Spring 2027

Microelectronic Devices

Microelectronic Devices covers semiconductor characteristics, physical mechanisms, and circuit modeling of solid-state electronic and photonic devices, plus microelectronic processing principles.

offering recorded3 credits
Recorded instructors · Spring 2027 Shubhra Pasayat

Summary

1 / 6

Past student reviews · Luke Mawst

One student rated the difficulty level as 2, though this was attributed more to the dry nature of the subject than specific workload intensity.

What you’ll be able to do

  • Explain the physical operation of microelectronic devices, such as diodes, bipolar junction transistors, and field-effect transistors

  • Identify design tradeoffs for electronic devices

  • Identify, evaluate and explain basic microelectronic processing techniques for device fabrication

  • Summarize basic semiconductor materials and their properties and implement them to examine new and emerging materials

Source: UW Guide

Grade history

↗
average GPA
letter grades
A
AB
B
BC
C
D
F

All recorded terms · compare terms & instructors

Prerequisites

Course map

(E C E 220 or 222),E C E 230, and PHYSICS/​E C E 235, or member of Engineering Guest Students

  • (E C E 220 or 222),E C E 230, and PHYSICS/E C E 235, or member of Engineering Guest Students
ECE 335 used by

“Used by” includes alternatives; linked courses may have other requirements. This is a best-effort interpretation; check the catalog requirements above.

Prerequisite text tree
  • (E C E 220 or 222),E C E 230, and PHYSICS/E C E 235, or member of Engineering Guest Students

Professors

Spring 2027

Recent recorded grades — Spring 2022: 3.38 GPA, 79.2% A/AB (n=24 letter grades); Spring 2023: 3.45 GPA, 64.5% A/AB (n=31 letter grades).

Historical instructors & teaching patterns

LUKE MAWST is recorded teaching in Fall 2008, Spring 2011, Spring 2016, Spring 2017, Spring 2018. Recorded history may be incomplete and does not establish a future schedule.

SHUBHRA PASAYAT is recorded teaching in Spring 2022, Spring 2023. Recorded history may be incomplete and does not establish a future schedule.

Recorded history may be incomplete and does not establish a future schedule.

Calendar & sections

Spring 2027

Schedule loads here as you scroll.

SectionModeEnrolled / capacityWaitlist
LEC 001Classroom Instruction0 / 690

Times are Central. Select a meeting for details; export includes recorded dates for the selected sections. Enrollment reflects scan time.

Meeting source records
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Student experience

the class

Past student reviews · Luke Mawst

Students described the subject matter as pretty dry, which contributed to a perception of the lectures as boring.

Recent recorded grades — Spring 2024: 3.17 GPA, 48.6% A/AB (n=35 letter grades); Spring 2025: 3.12 GPA, 46.4% A/AB (n=28 letter grades); Spring 2026: 3.35 GPA, 64.2% A/AB (n=53 letter grades).

difficulty & workload

Past student reviews · Luke Mawst

One student rated the difficulty level as 2, though this was attributed more to the dry nature of the subject than specific workload intensity.

Past student reviews · Luke Mawst

Past students reported that TAs read directly from notes without understanding them and did not answer questions during class sessions.

Topics

  • Semiconductor characteristics and material properties.
  • Physical mechanisms and circuit modeling of solid-state electronic and photonic devices.
  • Microelectronic processing principles and integrated circuit examples.

Skills

  • Explaining physical operation and circuit modeling of microelectronic devices like diodes, BJTs, and FETs.
  • Identifying design tradeoffs for electronic devices.
  • Evaluating microelectronic processing techniques for device fabrication and integrated circuits.
  • Summarizing semiconductor material properties to examine emerging materials.

Grades

Latest available · Spring 2026— not enough history to project Spring 2027.

average GPA
A / AB grades
letter grades
Instructor

Grade distribution · % of letter grades

A
AB
B
BC
C
D
F

Grades over time

Through Spring 2026

More grade details Grade mix, volume & source data

Where this course fits relative to

Latest available grades · Spring 2026 · all course levels

GPA

Higher than % of other courses in this group.

Course GPAs · red marks this course’s range

letter grades

More recorded grades than % of other courses in this group.

Typical course in this group: letter grades.

About this comparison

1280 courses over the same term, each with at least 30 recorded letter grades. Cross-listed courses count once. GPA is not a measure of difficulty or teaching quality. The typical course is the median by recorded grade count; tied values are not counted as lower. Grade counts describe course scale, not unique students or typical section size.

Descriptions compare GPA with this group’s average: at least 0.20 higher or lower; otherwise close to average. Section size uses median recorded enrollment: small up to 30, mid-sized 31–99, large 100+. Lectures and discussion/lab sections are described separately.

Sources & history

UW–Madison

Catalog & offerings

Descriptions, prerequisites, and recorded course offerings.

Catalog observation history

Observations at scan time; dates do not imply when a catalog change took effect.

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Selected offering source records
ECE 335 · Spring 2027

Microelectronic Devices

Recorded 2026-10-14
Raw records 
[
  {
    "run_id": "20261014T203208-0851c9a1",
    "semester": "1274",
    "observed_at": "2026-10-14 17:50:09.728220+00:00",
    "offering_id": "1274:320:006329",
    "course_id": "ECE 335",
    "course_uid": "course_c68e321742acccf5729b7953",
    "term_id": "1274",
    "source_course_id": "006329",
    "source_subject_id": "320",
    "title": "Microelectronic Devices",
    "credits_min": 3,
    "credits_max": 3,
    "typically_offered": "Fall, Spring"
  }
]
Rate My Professors

Student reviews

Original comments behind the course and instructor summaries.

Read original reviews
Download part 1
Madgrades

Grade history

Recorded grade distributions by term, section, and instructor.

Explore recorded grades
Dataset & model

Recorded 2026-10-14

View the dataset on Hugging Face
Model outputs & technical records
Qwen/Qwen3.8-27B
LLM outputs across runs
Download part 1
Full model traces

Recorded model configuration, reasoning, and tool conversations.

Download part 1
Model & dataset provenance 
{
  "model": "Qwen/Qwen3.8-27B",
  "model_revision": "1d4bf0f2ff6012fd82039f2fa52739d0dd7c60c0",
  "task_version": "17",
  "output_id": "97e9f95729defb59ea4acc4192f325f8f1b6c28f7c43a7036fedc2042c61ade5",
  "requirements_status": "needs_review",
  "dataset_revision": "fc1811fa52e581ea57a35c0cf3343f8740a8ffbf",
  "observed_at": "2026-10-14 17:50:09.728220+00:00"
}