Introduction to Microelectromechanical Systems
Introduction to MEMS technology, devices, and systems covering fabrication, process integration, material mechanics, sensors, actuators, microfluidics, optical/RF/BioMEMS, packaging, and CAD.
Summary
Past student reviews · Hongrui Jiang
Jiang did not give out full scores easily unless the work was impressive, though he was described as a pretty lenient grader overall.
What you’ll be able to do
Master fundamental fabrication techniques in integrated circuits and microelecromechanical systems (MEMS)
Analyze and construct fabrication process flows for MEMS
Analyze and design mechanical structures for MEMS
Analyze and design mechanical sensors and actuators
Analyze thermal and magnetic transducers, microfluidics, lab on chips, optical MEMS devices and radio frequency MEMS devices
Design systems integrating MEMS devices with integrated circuits
Source: UW Guide
Grade history
↗All recorded terms · compare terms & instructors
Prerequisites
Course map(E C E 335 or 340), graduate/professional standing, or member of Engineering Guest Students
This is a best-effort interpretation; check the catalog requirements above.
Professors
Spring 2027No instructors recorded for this selection.
Historical instructors & teaching patterns
HONGRUI JIANG is recorded teaching in Fall 2008, Fall 2010, Fall 2012, Fall 2014, Fall 2016, Fall 2018, Fall 2020, Fall 2023. Recorded history may be incomplete and does not establish a future schedule.
Recorded history may be incomplete and does not establish a future schedule.
Calendar & sections
Spring 2027Schedule loads here as you scroll.
| Section | Mode | Enrolled / capacity | Waitlist |
|---|
Times are Central. Select a meeting for details; export includes recorded dates for the selected sections.
Meeting source records
Student experience
the class
Past student reviews · Hongrui Jiang
Professor Jiang taught this course with a focus on his research, making homework sets fun and creative while keeping projects helpful for learning.
Recent recorded grades — Fall 2018: 3.68 GPA, 89.5% A/AB (n=19 letter grades); Fall 2020: 3.61 GPA, 90.9% A/AB (n=22 letter grades); Fall 2023: 3.67 GPA, 83.3% A/AB (n=24 letter grades).
difficulty & workload
Past student reviews · Hongrui Jiang
Jiang did not give out full scores easily unless the work was impressive, though he was described as a pretty lenient grader overall.
Past student reviews · Hongrui Jiang
Students found Jiang patient and willing to walk them through problems if they were respectful and admitted confusion, despite his sometimes condescending demeanor toward those who pretended to know the material.
Topics
- MEMS fabrication, process integration, material mechanics, sensors, and actuators.
- Microfluidics, optical MEMS, RF MEMS, BioMEMS, packaging, and CAD.
Skills
- Master fundamental fabrication techniques and analyze/construct fabrication process flows for MEMS.
- Analyze and design mechanical structures, sensors, and actuators for MEMS.
- Analyze transducers and specialized MEMS devices; design systems integrating MEMS with ICs.
Grades
Latest available · Fall 2023— not enough history to project Spring 2027.
Grade distribution · % of letter grades
Grades over time
Through Fall 2023
More grade details Grade mix, volume & source data
Not enough comparable courses for Spring 2027 in UW–Madison.
Sources & history
Catalog & offerings
Descriptions, prerequisites, and recorded course offerings.
Catalog observation history
Observations at scan time; dates do not imply when a catalog change took effect.
Selected offering source records
No offering records for the selected term.
Raw records
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Student reviews
Original comments behind the course and instructor summaries.
Read original reviews
Grade history
Recorded grade distributions by term, section, and instructor.
Explore recorded gradesRecorded 2026-10-14
Model outputs & technical records
LLM outputs across runs
Full model traces
Recorded model configuration, reasoning, and tool conversations.
Model & dataset provenance
{
"model": "Qwen/Qwen3.8-27B",
"model_revision": "1d4bf0f2ff6012fd82039f2fa52739d0dd7c60c0",
"task_version": "17",
"output_id": "3655b8f7510c0cdc2ee24c8f73c6548dae54672f5c93196113e731dc1a8bb930",
"requirements_status": "valid",
"dataset_revision": "fc1811fa52e581ea57a35c0cf3343f8740a8ffbf",
"observed_at": "2026-10-14 17:50:09.728220+00:00"
}