Recent recorded grades — Spring 2024: 3.05 GPA, 40.0% A/AB (n=10 letter grades); Spring 2025: 3.13 GPA, 47.4% A/AB (n=19 letter grades); Spring 2026: 3.30 GPA, 59.1% A/AB (n=22 letter grades).
Integrated Circuit Fabrication Laboratory
Integrated Circuit Fabrication Laboratory covering monolithic IC fabrication processes including mask making, photolithography, oxidation, diffusion, junction evaluation, metallization, packaging, and testing.
Summary
Recent recorded grades — Spring 2024: 3.05 GPA, 40.0% A/AB (n=10 letter grades); Spring 2025: 3.13 GPA, 47.4% A/AB (n=19 letter grades); Spring 2026: 3.30 GPA, 59.1% A/AB (n=22 letter grades).
What you’ll be able to do
Analyze, design and execute process flow used during semiconductor device fabrication
Perform simple electrical measurements of MOSFET transistors
Explain operating principles of clean room tools such as mask aligner, plasma etcher, metal deposition sputterer, etc.
Perform silicon processing steps in the clean room such as lithography, wet and dry etching, and metal deposition
Solve engineering problems related to silicon processing
Design and perform advanced electrical measurements of MOSFET devices
Source: UW Guide
Grade history
↗All recorded terms · compare terms & instructors
Prerequisites
Course map(E C E 335 or 548), graduate/professional standing, or member of Engineering Guest Students
This is a best-effort interpretation; check the catalog requirements above.
Professors
Spring 2027Historical instructors & teaching patterns
SRDJAN MILICIC is recorded teaching in Spring 2007, Spring 2008, Spring 2009, Spring 2010, Spring 2011, Spring 2012, Spring 2013, Spring 2014, Spring 2015, Spring 2018, Spring 2019, Spring 2020, Spring 2022, Spring 2023, Spring 2024, Spring 2025, Spring 2026. Recorded history may be incomplete and does not establish a future schedule.
Recorded history may be incomplete and does not establish a future schedule.
Calendar & sections
Spring 2027Schedule loads here as you scroll.
| Section | Mode | Enrolled / capacity | Waitlist |
|---|---|---|---|
| LEC 001 | Classroom Instruction | 0 / 24 | 0 |
| LAB 301 | Classroom Instruction | 0 / 24 | 0 |
Times are Central. Select a meeting for details; export includes recorded dates for the selected sections. Enrollment reflects scan time.
Meeting source records
Student experience
the class
Recent recorded grades — Spring 2024: 3.05 GPA, 40.0% A/AB (n=10 letter grades); Spring 2025: 3.13 GPA, 47.4% A/AB (n=19 letter grades); Spring 2026: 3.30 GPA, 59.1% A/AB (n=22 letter grades).
difficulty & workload
No workload feedback recorded.
Topics
- Monolithic integrated circuit fabrication
- Mask making, photolithography, oxidation, and diffusion
- Junction evaluation, metallization, packaging, and testing
- Operating principles of clean room tools
- Electrical measurements of MOSFET transistors
Skills
- Analyze, design, and execute semiconductor device fabrication process flows
- Perform simple electrical measurements of MOSFET transistors
- Explain operating principles of clean room tools including mask aligners, plasma etchers, and metal deposition sputterers
- Perform silicon processing steps such as lithography, wet and dry etching, and metal deposition
- Solve engineering problems related to silicon processing
- Design and perform advanced electrical measurements of MOSFET devices
Grades
Latest available · Spring 2026— not enough history to project Spring 2027.
Grade distribution · % of letter grades
Grades over time
Through Spring 2026
More grade details Grade mix, volume & source data
Not enough comparable courses for Spring 2027 in UW–Madison.
Sources & history
Catalog & offerings
Descriptions, prerequisites, and recorded course offerings.
Catalog observation history
Observations at scan time; dates do not imply when a catalog change took effect.
Selected offering source records
Integrated Circuit Fabrication Laboratory
Recorded 2026-10-14Raw records
[
{
"run_id": "20261014T203208-0851c9a1",
"semester": "1274",
"observed_at": "2026-10-14 17:50:09.728220+00:00",
"offering_id": "1274:320:006431",
"course_id": "ECE 549",
"course_uid": "course_31682fbca2753058cfbfcf1d",
"term_id": "1274",
"source_course_id": "006431",
"source_subject_id": "320",
"title": "Integrated Circuit Fabrication Laboratory",
"credits_min": 4,
"credits_max": 4,
"typically_offered": "Spring"
}
]Student reviews
Original comments behind the course and instructor summaries.
Read original reviews
No records available.
Grade history
Recorded grade distributions by term, section, and instructor.
Explore recorded gradesRecorded 2026-10-14
Model outputs & technical records
LLM outputs across runs
Full model traces
Recorded model configuration, reasoning, and tool conversations.
Model & dataset provenance
{
"model": "Qwen/Qwen3.8-27B",
"model_revision": "1d4bf0f2ff6012fd82039f2fa52739d0dd7c60c0",
"task_version": "17",
"output_id": "bd53c45bc2f4961314dc64ce3887dc1fe35550177ad8721cb79c73b004566997",
"requirements_status": "valid",
"dataset_revision": "fc1811fa52e581ea57a35c0cf3343f8740a8ffbf",
"observed_at": "2026-10-14 17:50:09.728220+00:00"
}