Integrated Circuit Fabrication Laboratory

Integrated Circuit Fabrication Laboratory covering monolithic IC fabrication processes including mask making, photolithography, oxidation, diffusion, junction evaluation, metallization, packaging, and testing.

offering recorded4 credits
Recorded instructors · Spring 2027 Srdjan Milicic2.7/5

Summary

1 / 3

Recent recorded grades — Spring 2024: 3.05 GPA, 40.0% A/AB (n=10 letter grades); Spring 2025: 3.13 GPA, 47.4% A/AB (n=19 letter grades); Spring 2026: 3.30 GPA, 59.1% A/AB (n=22 letter grades).

What you’ll be able to do

  • Analyze, design and execute process flow used during semiconductor device fabrication

  • Perform simple electrical measurements of MOSFET transistors

  • Explain operating principles of clean room tools such as mask aligner, plasma etcher, metal deposition sputterer, etc.

  • Perform silicon processing steps in the clean room such as lithography, wet and dry etching, and metal deposition

  • Solve engineering problems related to silicon processing

  • Design and perform advanced electrical measurements of MOSFET devices

Source: UW Guide

Grade history

↗
average GPA
letter grades
A
AB
B
BC
C
D
F

All recorded terms · compare terms & instructors

Prerequisites

Course map

(E C E 335 or 548), graduate/professional standing, or member of Engineering Guest Students

    • take one
    • graduate/professional standing
    • member of Engineering Guest Students
    take one
ECE 549

This is a best-effort interpretation; check the catalog requirements above.

Prerequisite text tree
  • Any of
    • Any of
    • graduate/professional standing
    • member of Engineering Guest Students

Professors

Spring 2027
Adjusted rating
RMP difficulty
captured reviews
About this rating

Raw average: 1.96/5 from 24 quality ratings. The adjusted rating blends this with the UW review average (3.66/5), weighted as 20 additional ratings. Smaller samples stay closer to that average. Each captured review is counted once in the prior; this does not correct who chooses to leave a review.

RMP profile ↗ · All captured review dates; profile matched by name.

Recent recorded grades — Spring 2024: 3.05 GPA, 40.0% A/AB (n=10 letter grades); Spring 2025: 3.13 GPA, 47.4% A/AB (n=19 letter grades); Spring 2026: 3.30 GPA, 59.1% A/AB (n=22 letter grades).

Historical instructors & teaching patterns

SRDJAN MILICIC is recorded teaching in Spring 2007, Spring 2008, Spring 2009, Spring 2010, Spring 2011, Spring 2012, Spring 2013, Spring 2014, Spring 2015, Spring 2018, Spring 2019, Spring 2020, Spring 2022, Spring 2023, Spring 2024, Spring 2025, Spring 2026. Recorded history may be incomplete and does not establish a future schedule.

Recorded history may be incomplete and does not establish a future schedule.

Calendar & sections

Spring 2027

Schedule loads here as you scroll.

SectionModeEnrolled / capacityWaitlist
LEC 001Classroom Instruction0 / 240
LAB 301Classroom Instruction0 / 240

Times are Central. Select a meeting for details; export includes recorded dates for the selected sections. Enrollment reflects scan time.

Meeting source records

Student experience

the class

Recent recorded grades — Spring 2024: 3.05 GPA, 40.0% A/AB (n=10 letter grades); Spring 2025: 3.13 GPA, 47.4% A/AB (n=19 letter grades); Spring 2026: 3.30 GPA, 59.1% A/AB (n=22 letter grades).

difficulty & workload

No workload feedback recorded.

Topics

  • Monolithic integrated circuit fabrication
  • Mask making, photolithography, oxidation, and diffusion
  • Junction evaluation, metallization, packaging, and testing
  • Operating principles of clean room tools
  • Electrical measurements of MOSFET transistors

Skills

  • Analyze, design, and execute semiconductor device fabrication process flows
  • Perform simple electrical measurements of MOSFET transistors
  • Explain operating principles of clean room tools including mask aligners, plasma etchers, and metal deposition sputterers
  • Perform silicon processing steps such as lithography, wet and dry etching, and metal deposition
  • Solve engineering problems related to silicon processing
  • Design and perform advanced electrical measurements of MOSFET devices

Grades

Latest available · Spring 2026— not enough history to project Spring 2027.

average GPA
A / AB grades
letter grades
Instructor

Grade distribution · % of letter grades

A
AB
B
BC
C
D
F

Grades over time

Through Spring 2026

More grade details Grade mix, volume & source data

Not enough comparable courses for Spring 2027 in UW–Madison.

Sources & history

UW–Madison

Catalog & offerings

Descriptions, prerequisites, and recorded course offerings.

Catalog observation history

Observations at scan time; dates do not imply when a catalog change took effect.

Selected offering source records
ECE 549 · Spring 2027

Integrated Circuit Fabrication Laboratory

Recorded 2026-10-14
Raw records
[
  {
    "run_id": "20261014T203208-0851c9a1",
    "semester": "1274",
    "observed_at": "2026-10-14 17:50:09.728220+00:00",
    "offering_id": "1274:320:006431",
    "course_id": "ECE 549",
    "course_uid": "course_31682fbca2753058cfbfcf1d",
    "term_id": "1274",
    "source_course_id": "006431",
    "source_subject_id": "320",
    "title": "Integrated Circuit Fabrication Laboratory",
    "credits_min": 4,
    "credits_max": 4,
    "typically_offered": "Spring"
  }
]
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Madgrades

Grade history

Recorded grade distributions by term, section, and instructor.

Explore recorded grades
Model outputs & technical records
Qwen/Qwen3.8-27B
LLM outputs across runs
Full model traces

Recorded model configuration, reasoning, and tool conversations.

Model & dataset provenance
{
  "model": "Qwen/Qwen3.8-27B",
  "model_revision": "1d4bf0f2ff6012fd82039f2fa52739d0dd7c60c0",
  "task_version": "17",
  "output_id": "bd53c45bc2f4961314dc64ce3887dc1fe35550177ad8721cb79c73b004566997",
  "requirements_status": "valid",
  "dataset_revision": "fc1811fa52e581ea57a35c0cf3343f8740a8ffbf",
  "observed_at": "2026-10-14 17:50:09.728220+00:00"
}