Fall 2026

Integrated Circuit Fabrication Laboratory

ECE 549 is an integrated circuit fabrication laboratory covering mask making, photolithography, oxidation, diffusion, junction evaluation, metallization, packaging, and testing.

no offering record for this termCredits unavailable
Recorded instructors · Fall 2026 No instructors listed

Summary

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Recent recorded grades — Spring 2024: 3.05 GPA, 40.0% A/AB (n=10 letter grades); Spring 2025: 3.13 GPA, 47.4% A/AB (n=19 letter grades); Spring 2026: 3.30 GPA, 59.1% A/AB (n=22 letter grades).

Grade history

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average GPA
letter grades
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AB
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Prerequisites

Course map

(E C E 335 or 548), graduate/professional standing, or member of Engineering Guest Students

    • ECE 335
    • ECE 548
    • graduate/professional standing, or member of Engineering Guest Students
    take one
ECE 549

This is a best-effort interpretation; check the catalog requirements above.

Prerequisite text tree
  • Any of
    • ECE 335
    • ECE 548
    • graduate/professional standing, or member of Engineering Guest Students

Professors

Fall 2026

No instructors recorded for this selection.

Historical instructors & teaching patterns

Recorded history may be incomplete and does not establish a future schedule.

Calendar & sections

Fall 2026

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SectionModeEnrolled / capacityWaitlist

Times are Central. Select a meeting for details; export includes recorded dates for the selected sections.

Meeting source records

No records available.

Student experience

the class

Recent recorded grades — Spring 2024: 3.05 GPA, 40.0% A/AB (n=10 letter grades); Spring 2025: 3.13 GPA, 47.4% A/AB (n=19 letter grades); Spring 2026: 3.30 GPA, 59.1% A/AB (n=22 letter grades).

difficulty & workload

No workload feedback recorded.

Topics

  • Monolithic integrated circuit fabrication
  • Mask making and photolithography
  • Oxidation, diffusion, and junction evaluation
  • Metallization, packaging, and testing

Skills

  • Performing monolithic integrated circuit fabrication steps including mask making, photolithography, oxidation, diffusion, junction evaluation, metallization, packaging, and testing.

Grades

Latest available · Spring 2026— not enough history to project Fall 2026.

average GPA
A / AB grades
letter grades
Instructor

Grade distribution · % of letter grades

A
AB
B
BC
C
D
F

Grades over time

Through Spring 2026

More grade details Grade mix, volume & source data

Not enough comparable courses for Fall 2026 in UW–Madison.

Sources & history

UW–Madison

Catalog & offerings

Descriptions, prerequisites, and recorded course offerings.

Catalog observation history

Observations at scan time; dates do not imply when a catalog change took effect.

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Selected offering source records

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Raw records 
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Student reviews

Original comments behind the course and instructor summaries.

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Madgrades

Grade history

Recorded grade distributions by term, section, and instructor.

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Dataset & model

Recorded 2026-09-07

View the dataset on Hugging Face
Model outputs & technical records
nvidia/Qwen3.6-35B-A3B-NVFP4
LLM outputs across runs
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Full model traces

Recorded model configuration, reasoning, and tool conversations.

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Model & dataset provenance 
{
  "model": "nvidia/Qwen3.6-35B-A3B-NVFP4",
  "model_revision": "1355db6a052410cfd62085d94b58866fd0f2c3c5",
  "task_version": "14",
  "output_id": "5c5855faa701bfcb133198aca5dd2ceee455fdc59a3f8aede103701121dc4591",
  "requirements_status": "valid",
  "dataset_revision": "e243353dcb7d79b7247ced91d69443ef4c2a6349",
  "observed_at": "2026-09-07 15:55:43.033547+00:00"
}