Spring 2027

Microprocessing of Materials

Microprocessing of Materials integrates materials science theory and engineering practice to process materials at the microscopic level.

offering recorded3 credits
Recorded instructors · Spring 2027 Chang-Beom Eom

Summary

1 / 3

Recent recorded grades — Spring 2024: 3.06 GPA, 41.7% A/AB (n=24 letter grades); Spring 2025: 3.18 GPA, 42.9% A/AB (n=28 letter grades); Spring 2026: 3.25 GPA, 50.0% A/AB (n=16 letter grades).

What you’ll be able to do

  • Explain basic semiconductor physics, and apply these same physics to approximate device carrier densities, mobility, switching behavior, and other electronically related quantities

  • Design process flows based on the physical processes required for desired outcomes in target semiconductor device structures

  • Describe how lithography processes are executed and be able to weigh the benefits of each lithography technique against each other

  • Analyze device characteristics and connect this analysis with designed process flows

Source: UW Guide

Grade history

↗
average GPA
letter grades
A
AB
B
BC
C
D
F

All recorded terms · compare terms & instructors

Prerequisites

Course map

M S & E 350, 351, or CBE 440, or member of Engineering Guest Students

MS&E 333 used by

“Used by” includes alternatives; linked courses may have other requirements. This is a best-effort interpretation; check the catalog requirements above.

Prerequisite text tree

Professors

Spring 2027

Recent recorded grades — Spring 2017: 3.76 GPA, 96.1% A/AB (n=51 letter grades); Spring 2018: 3.73 GPA, 91.1% A/AB (n=45 letter grades); Spring 2019: 3.69 GPA, 89.2% A/AB (n=65 letter grades).

Historical instructors & teaching patterns

CHANG-BEOM EOM is recorded teaching in Spring 2007, Spring 2008, Spring 2009, Spring 2010, Spring 2011, Spring 2012, Spring 2013, Spring 2015, Spring 2016, Spring 2017, Spring 2018, Spring 2019. Recorded history may be incomplete and does not establish a future schedule.

Recorded history may be incomplete and does not establish a future schedule.

Calendar & sections

Spring 2027

Schedule loads here as you scroll.

SectionModeEnrolled / capacityWaitlist
LEC 001Classroom Instruction0 / 430
DIS 301Classroom Instruction0 / 430

Times are Central. Select a meeting for details; export includes recorded dates for the selected sections. Enrollment reflects scan time.

Meeting source records
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Student experience

the class

Recent recorded grades — Spring 2024: 3.06 GPA, 41.7% A/AB (n=24 letter grades); Spring 2025: 3.18 GPA, 42.9% A/AB (n=28 letter grades); Spring 2026: 3.25 GPA, 50.0% A/AB (n=16 letter grades).

difficulty & workload

No workload feedback recorded.

Topics

  • Materials science theory and engineering practice applied to microscopic material processing.
  • Basic semiconductor physics including carrier densities, mobility, and switching behavior.
  • Execution of lithography processes and comparative benefits of different lithography techniques.

Skills

  • Explain basic semiconductor physics and apply it to approximate device carrier densities, mobility, and switching behavior.
  • Design process flows based on physical processes required for desired outcomes in target semiconductor device structures.
  • Describe how lithography processes are executed and weigh the benefits of different lithography techniques against each other.
  • Analyze device characteristics and connect this analysis with designed process flows.

Grades

Latest available · Spring 2026— not enough history to project Spring 2027.

average GPA
A / AB grades
letter grades
Instructor

Grade distribution · % of letter grades

A
AB
B
BC
C
D
F

Grades over time

Through Spring 2026

More grade details Grade mix, volume & source data

Not enough comparable courses for Spring 2027 in UW–Madison.

Sources & history

UW–Madison

Catalog & offerings

Descriptions, prerequisites, and recorded course offerings.

Catalog observation history

Observations at scan time; dates do not imply when a catalog change took effect.

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Selected offering source records
MS&E 333 · Spring 2027

Microprocessing of Materials

Recorded 2026-10-29
Raw records 
[
  {
    "run_id": "20261029T213040-0fa85c20",
    "semester": "1274",
    "observed_at": "2026-10-29 21:30:40.248904+00:00",
    "offering_id": "1274:636:012619",
    "course_id": "MS&E 333",
    "course_uid": "course_16ec62e27a725e15f6c766b5",
    "term_id": "1274",
    "source_course_id": "012619",
    "source_subject_id": "636",
    "title": "Microprocessing of Materials",
    "credits_min": 3,
    "credits_max": 3,
    "typically_offered": "Spring"
  }
]
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Student reviews

Original comments behind the course and instructor summaries.

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Madgrades

Grade history

Recorded grade distributions by term, section, and instructor.

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Dataset & model

Recorded 2026-10-29

View the dataset on Hugging Face
Model outputs & technical records
Qwen/Qwen3.8-27B
LLM outputs across runs
Download part 1
Full model traces

Recorded model configuration, reasoning, and tool conversations.

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Model & dataset provenance 
{
  "model": "Qwen/Qwen3.8-27B",
  "model_revision": "1d4bf0f2ff6012fd82039f2fa52739d0dd7c60c0",
  "task_version": "17",
  "output_id": "6d3495e4b69f457c6725af910bae2684f75fb333146c3262d91e8d740c52b367",
  "requirements_status": "needs_review",
  "dataset_revision": "c9cd06eaa45f9ddf7e69faa38b89ff3d3dd995dd",
  "observed_at": "2026-10-29 21:30:40.248904+00:00"
}