Spring 2027

Microprocessing of Materials

Microprocessing of Materials integrates materials science theory and engineering practice to process materials at the microscopic level.

offering recorded3 credits
Recorded instructors · Spring 2027 Daniel Rhodes3.5/5

Summary

1 / 3

Recent recorded grades — Spring 2024: 3.06 GPA, 41.7% A/AB (n=24 letter grades); Spring 2025: 3.18 GPA, 42.9% A/AB (n=28 letter grades); Spring 2026: 3.25 GPA, 50.0% A/AB (n=16 letter grades).

What you’ll be able to do

  • Explain basic semiconductor physics, and apply these same physics to approximate device carrier densities, mobility, switching behavior, and other electronically related quantities

  • Design process flows based on the physical processes required for desired outcomes in target semiconductor device structures

  • Describe how lithography processes are executed and be able to weigh the benefits of each lithography technique against each other

  • Analyze device characteristics and connect this analysis with designed process flows

Source: UW Guide

Grade history

↗
average GPA
letter grades
A
AB
B
BC
C
D
F

All recorded terms · compare terms & instructors

Prerequisites

Course map

M S & E 350, 351, or CBE 440, or member of Engineering Guest Students

MS&E 333 used by

“Used by” includes alternatives; linked courses may have other requirements. This is a best-effort interpretation; check the catalog requirements above.

Prerequisite text tree

Professors

Spring 2027
Adjusted rating
RMP difficulty
captured reviews
About this rating

Raw average: 3.00/5 from 4 quality ratings. The adjusted rating blends this with the UW review average (3.66/5), weighted as 20 additional ratings. Smaller samples stay closer to that average. Each captured review is counted once in the prior; this does not correct who chooses to leave a review.

RMP profile ↗ · All captured review dates; profile matched by name.

Recent recorded grades — Spring 2024: 3.06 GPA, 41.7% A/AB (n=24 letter grades); Spring 2025: 3.18 GPA, 42.9% A/AB (n=28 letter grades); Spring 2026: 3.25 GPA, 50.0% A/AB (n=16 letter grades).

Historical instructors & teaching patterns

DANIEL RHODES is recorded teaching in Spring 2020, Spring 2022, Spring 2023, Spring 2024, Spring 2025, Spring 2026. Recorded history may be incomplete and does not establish a future schedule.

Recorded history may be incomplete and does not establish a future schedule.

Calendar & sections

Spring 2027

Schedule loads here as you scroll.

SectionModeEnrolled / capacityWaitlist
LEC 001Classroom Instruction0 / 430
DIS 301Classroom Instruction0 / 430

Times are Central. Select a meeting for details; export includes recorded dates for the selected sections. Enrollment reflects scan time.

Meeting source records
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Student experience

the class

Recent recorded grades — Spring 2024: 3.06 GPA, 41.7% A/AB (n=24 letter grades); Spring 2025: 3.18 GPA, 42.9% A/AB (n=28 letter grades); Spring 2026: 3.25 GPA, 50.0% A/AB (n=16 letter grades).

difficulty & workload

No workload feedback recorded.

Topics

  • Materials science theory and engineering practice applied to microscopic material processing.
  • Basic semiconductor physics including carrier densities, mobility, and switching behavior.
  • Execution of lithography processes and comparative benefits of different lithography techniques.

Skills

  • Explain basic semiconductor physics and apply it to approximate device carrier densities, mobility, and switching behavior.
  • Design process flows based on physical processes required for desired outcomes in target semiconductor device structures.
  • Describe how lithography processes are executed and weigh the benefits of different lithography techniques against each other.
  • Analyze device characteristics and connect this analysis with designed process flows.

Grades

Latest available · Spring 2026— not enough history to project Spring 2027.

average GPA
A / AB grades
letter grades
Instructor

Grade distribution · % of letter grades

A
AB
B
BC
C
D
F

Grades over time

Through Spring 2026

More grade details Grade mix, volume & source data

Not enough comparable courses for Spring 2027 in UW–Madison.

Sources & history

UW–Madison

Catalog & offerings

Descriptions, prerequisites, and recorded course offerings.

Catalog observation history

Observations at scan time; dates do not imply when a catalog change took effect.

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Selected offering source records
MS&E 333 · Spring 2027

Microprocessing of Materials

Recorded 2026-10-14
Raw records 
[
  {
    "run_id": "20261014T203208-0851c9a1",
    "semester": "1274",
    "observed_at": "2026-10-14 17:50:09.728220+00:00",
    "offering_id": "1274:636:012619",
    "course_id": "MS&E 333",
    "course_uid": "course_16ec62e27a725e15f6c766b5",
    "term_id": "1274",
    "source_course_id": "012619",
    "source_subject_id": "636",
    "title": "Microprocessing of Materials",
    "credits_min": 3,
    "credits_max": 3,
    "typically_offered": "Spring"
  }
]
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Student reviews

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Madgrades

Grade history

Recorded grade distributions by term, section, and instructor.

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Dataset & model

Recorded 2026-10-14

View the dataset on Hugging Face
Model outputs & technical records
Qwen/Qwen3.8-27B
LLM outputs across runs
Download part 1
Full model traces

Recorded model configuration, reasoning, and tool conversations.

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Model & dataset provenance 
{
  "model": "Qwen/Qwen3.8-27B",
  "model_revision": "1d4bf0f2ff6012fd82039f2fa52739d0dd7c60c0",
  "task_version": "17",
  "output_id": "030871a3caa87a8f89e245bb860e7b26b8cdcc64438b19064e5d57f54e0d17f8",
  "requirements_status": "needs_review",
  "dataset_revision": "fc1811fa52e581ea57a35c0cf3343f8740a8ffbf",
  "observed_at": "2026-10-14 17:50:09.728220+00:00"
}