[{"run_id":"20261014T203208-0851c9a1","observed_at":"2026-10-14 17:50:09.728220+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"d03f933070a53a81c2661877ad99da8e62e69c3703d0a2041c2eaa02c456dad2","record_version_id":"dcce185a0b1e8a5b564d959abfcc2a014b23620620314485bc10646e141c1b41","job_id":"enrich-49752a259f17fab0f49665b3","output_id":"12fed033212cba97d164b1163a6ba845c007c7df15d36605a848b2b369762244","section":"requirements","status":"valid","value_json":"{\"nodes\":[{\"children\":[\"n1\",\"n2\",\"n3\"],\"condition\":null,\"course\":null,\"evidence\":\"(M S & E 330and351), graduate/professional standing, or member of Engineering Guest Students\",\"id\":\"root\",\"kind\":\"any\"},{\"children\":[\"c330\",\"c351\"],\"condition\":null,\"course\":null,\"evidence\":\"(M S & E 330and351)\",\"id\":\"n1\",\"kind\":\"all\"},{\"children\":[],\"condition\":\"graduate/professional standing\",\"course\":null,\"evidence\":\"graduate/professional standing\",\"id\":\"n2\",\"kind\":\"condition\"},{\"children\":[],\"condition\":\"member of Engineering Guest Students\",\"course\":null,\"evidence\":\"member of Engineering Guest Students\",\"id\":\"n3\",\"kind\":\"condition\"},{\"children\":[],\"condition\":null,\"course\":{\"course_number\":330,\"minimum_grade\":null,\"subjects\":[\"MS&E\"],\"timing\":\"prior\"},\"evidence\":\"M S & E 330\",\"id\":\"c330\",\"kind\":\"course\"},{\"children\":[],\"condition\":null,\"course\":{\"course_number\":351,\"minimum_grade\":null,\"subjects\":[\"MS&E\"],\"timing\":\"prior\"},\"evidence\":\"351\",\"id\":\"c351\",\"kind\":\"course\"}],\"notes\":[],\"root\":\"root\",\"status\":\"parsed\"}","candidate_json":null,"error":null,"model":"Qwen/Qwen3.8-27B","model_revision":"1d4bf0f2ff6012fd82039f2fa52739d0dd7c60c0","selected_for_release":true},{"run_id":"20261014T203208-0851c9a1","observed_at":"2026-10-14 17:50:09.728220+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"d03f933070a53a81c2661877ad99da8e62e69c3703d0a2041c2eaa02c456dad2","record_version_id":"dcce185a0b1e8a5b564d959abfcc2a014b23620620314485bc10646e141c1b41","job_id":"enrich-49752a259f17fab0f49665b3","output_id":"12fed033212cba97d164b1163a6ba845c007c7df15d36605a848b2b369762244","section":"search_profile","status":"valid","value_json":"{\"activity_tags\":[{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Introduction to major thin-film deposition techniques and properties of thin films. Evaporation, plasma assisted processes with emphasis on sputter deposition, chemical vapor deposition ion beams. Film properties and characterization methods, applications.\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"label\":\"lab-work\"}],\"assumed_background\":[],\"search_phrases\":[\"thin-film deposition\",\"sputter deposition\",\"chemical vapor deposition\",\"plasma assisted processes\",\"film characterization\",\"evaporation\",\"ion beams\",\"MBE\",\"laser ablation\",\"vacuum science\"],\"skills_taught\":[{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"official_learning_outcomes\",\"outcome_index\":0,\"quote\":\"Apply concepts of the kinetic theory of gases to vacuum science and technology\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Apply kinetic theory of gases to vacuum science and technology\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"official_learning_outcomes\",\"outcome_index\":1,\"quote\":\"Explain the principles of evaporation, sputtering, molecular beam epitaxy (MBE), laser ablation, and chemical vapor deposition\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Explain principles of evaporation, sputtering, MBE, laser ablation, and CVD\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"official_learning_outcomes\",\"outcome_index\":2,\"quote\":\"Explain the concept of epitaxy in thin films\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Explain the concept of epitaxy in thin films\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"official_learning_outcomes\",\"outcome_index\":3,\"quote\":\"Explain the principles of various thin film characterization techniques\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Explain principles of thin film characterization techniques\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"official_learning_outcomes\",\"outcome_index\":4,\"quote\":\"Design thin film deposition systems\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Design thin film deposition systems\"}],\"summary\":{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"title\",\"quote\":\"INTRODUCTION TO THIN-FILM DEPOSITION PROCESSES\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"},{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Introduction to major thin-film deposition techniques and properties of thin films. Evaporation, plasma assisted processes with emphasis on sputter deposition, chemical vapor deposition ion beams. Film properties and characterization methods, applications.\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Introduction to major thin-film deposition techniques including evaporation, sputtering, CVD, and ion beams, plus film properties and characterization methods.\"},\"topics\":[{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Evaporation, plasma assisted processes with emphasis on sputter deposition, chemical vapor deposition ion beams.\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Thin-film deposition techniques: evaporation, sputtering, CVD, ion beams\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Film properties and characterization methods, applications.\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Film properties, characterization methods, and applications\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"official_learning_outcomes\",\"outcome_index\":0,\"quote\":\"Apply concepts of the kinetic theory of gases to vacuum science and technology\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Kinetic theory of gases applied to vacuum science and technology\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"official_learning_outcomes\",\"outcome_index\":2,\"quote\":\"Explain the concept of epitaxy in thin films\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Epitaxy in thin films\"}]}","candidate_json":null,"error":null,"model":"Qwen/Qwen3.8-27B","model_revision":"1d4bf0f2ff6012fd82039f2fa52739d0dd7c60c0","selected_for_release":true},{"run_id":"20261014T203208-0851c9a1","observed_at":"2026-10-14 17:50:09.728220+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"d03f933070a53a81c2661877ad99da8e62e69c3703d0a2041c2eaa02c456dad2","record_version_id":"dcce185a0b1e8a5b564d959abfcc2a014b23620620314485bc10646e141c1b41","job_id":"enrich-49752a259f17fab0f49665b3","output_id":"12fed033212cba97d164b1163a6ba845c007c7df15d36605a848b2b369762244","section":"student_experience","status":"insufficient_evidence","value_json":"{\"status\":\"insufficient_evidence\",\"themes\":[]}","candidate_json":null,"error":null,"model":"Qwen/Qwen3.8-27B","model_revision":"1d4bf0f2ff6012fd82039f2fa52739d0dd7c60c0","selected_for_release":true},{"run_id":"20261014T203208-0851c9a1","observed_at":"2026-10-14 17:50:09.728220+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"d03f933070a53a81c2661877ad99da8e62e69c3703d0a2041c2eaa02c456dad2","record_version_id":"dcce185a0b1e8a5b564d959abfcc2a014b23620620314485bc10646e141c1b41","job_id":"enrich-49752a259f17fab0f49665b3","output_id":"12fed033212cba97d164b1163a6ba845c007c7df15d36605a848b2b369762244","section":"student_summary","status":"valid","value_json":"{\"context_hash\":\"be01ac95cb91b77253fe6066432c0ba01dccc7442e342b90adbd90e6fb9d1802\",\"course_id\":\"MS&E 434\",\"current_instructors\":[{\"instructor_uid\":\"instructor_5f1c792a1a0cf2938fd8021b\",\"message\":\"No course-specific reviews available\",\"name\":\"Chang-Beom Eom\",\"review_status\":\"no_course_reviews\",\"rmp_instructor_id\":null,\"summary\":[{\"citations\":[{\"course_id\":\"MS&E 434\",\"run_id\":\"20261014T203208-0851c9a1\",\"section_number\":1,\"source_course_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"source_record\":{\"entity_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"file\":\"tables/observations.parquet\",\"kind\":\"grades\",\"source\":\"madgrades\"},\"table\":\"section_grades_latest\",\"term_id\":\"1244\",\"type\":\"grade\"},{\"course_id\":\"MS&E 434\",\"run_id\":\"20261014T203208-0851c9a1\",\"section_number\":1,\"source_course_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"source_record\":{\"entity_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"file\":\"tables/observations.parquet\",\"kind\":\"grades\",\"source\":\"madgrades\"},\"table\":\"section_grades_latest\",\"term_id\":\"1254\",\"type\":\"grade\"},{\"course_id\":\"MS&E 434\",\"run_id\":\"20261014T203208-0851c9a1\",\"section_number\":1,\"source_course_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"source_record\":{\"entity_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"file\":\"tables/observations.parquet\",\"kind\":\"grades\",\"source\":\"madgrades\"},\"table\":\"section_grades_latest\",\"term_id\":\"1264\",\"type\":\"grade\"}],\"text\":\"Recent recorded grades — Spring 2024: 3.94 GPA, 100.0% A/AB (n=16 letter grades); Spring 2025: 3.93 GPA, 100.0% A/AB (n=7 letter grades); Spring 2026: 3.86 GPA, 92.9% A/AB (n=14 letter grades).\"}]}],\"difficulty_workload\":[],\"errors\":[],\"historical_context\":[],\"message\":\"No course-specific reviews available\",\"offered\":true,\"profile_hash\":\"3f5110430805ccdd533c0c072df62d68a8a5f5441c4530bbdb15d419a199a09c\",\"quick_take\":[{\"citations\":[{\"course_id\":\"MS&E 434\",\"run_id\":\"20261014T203208-0851c9a1\",\"source_record\":{\"entity_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"file\":\"tables/observations.parquet\",\"kind\":\"grades\",\"source\":\"madgrades\"},\"table\":\"grades_latest\",\"term_id\":\"1244\",\"type\":\"grade\"},{\"course_id\":\"MS&E 434\",\"run_id\":\"20261014T203208-0851c9a1\",\"source_record\":{\"entity_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"file\":\"tables/observations.parquet\",\"kind\":\"grades\",\"source\":\"madgrades\"},\"table\":\"grades_latest\",\"term_id\":\"1254\",\"type\":\"grade\"},{\"course_id\":\"MS&E 434\",\"run_id\":\"20261014T203208-0851c9a1\",\"source_record\":{\"entity_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"file\":\"tables/observations.parquet\",\"kind\":\"grades\",\"source\":\"madgrades\"},\"table\":\"grades_latest\",\"term_id\":\"1264\",\"type\":\"grade\"}],\"text\":\"Recent recorded grades — Spring 2024: 3.94 GPA, 100.0% A/AB (n=16 letter grades); Spring 2025: 3.93 GPA, 100.0% A/AB (n=7 letter grades); Spring 2026: 3.86 GPA, 92.9% A/AB (n=14 letter grades).\"}],\"student_experience\":[],\"task_hash\":\"9dea82ef7f2113a5605c1c6030c4f9b19967eb742cc93a78268fb92357d29f5c\",\"teaching_history\":[{\"citations\":[{\"course_id\":\"MS&E 434\",\"run_id\":\"20261014T203208-0851c9a1\",\"section_number\":1,\"source_course_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"source_record\":{\"entity_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"file\":\"tables/observations.parquet\",\"kind\":\"grades\",\"source\":\"madgrades\"},\"table\":\"section_grades_latest\",\"term_id\":\"1204\",\"type\":\"grade\"},{\"course_id\":\"MS&E 434\",\"run_id\":\"20261014T203208-0851c9a1\",\"section_number\":1,\"source_course_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"source_record\":{\"entity_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"file\":\"tables/observations.parquet\",\"kind\":\"grades\",\"source\":\"madgrades\"},\"table\":\"section_grades_latest\",\"term_id\":\"1224\",\"type\":\"grade\"},{\"course_id\":\"MS&E 434\",\"run_id\":\"20261014T203208-0851c9a1\",\"section_number\":1,\"source_course_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"source_record\":{\"entity_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"file\":\"tables/observations.parquet\",\"kind\":\"grades\",\"source\":\"madgrades\"},\"table\":\"section_grades_latest\",\"term_id\":\"1244\",\"type\":\"grade\"},{\"course_id\":\"MS&E 434\",\"run_id\":\"20261014T203208-0851c9a1\",\"section_number\":1,\"source_course_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"source_record\":{\"entity_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"file\":\"tables/observations.parquet\",\"kind\":\"grades\",\"source\":\"madgrades\"},\"table\":\"section_grades_latest\",\"term_id\":\"1254\",\"type\":\"grade\"},{\"course_id\":\"MS&E 434\",\"run_id\":\"20261014T203208-0851c9a1\",\"section_number\":1,\"source_course_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"source_record\":{\"entity_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"file\":\"tables/observations.parquet\",\"kind\":\"grades\",\"source\":\"madgrades\"},\"table\":\"section_grades_latest\",\"term_id\":\"1264\",\"type\":\"grade\"}],\"text\":\"CHANG-BEOM EOM is recorded teaching in Spring 2020, Spring 2022, Spring 2024, Spring 2025, Spring 2026. Recorded history may be incomplete and does not establish a future schedule.\"}],\"term_id\":\"1274\",\"term_name\":\"2027 Sprng\",\"version\":3}","candidate_json":null,"error":null,"model":"Qwen/Qwen3.8-27B","model_revision":"1d4bf0f2ff6012fd82039f2fa52739d0dd7c60c0","selected_for_release":true},{"run_id":"20260906T231458-5fdd2fff","observed_at":"2026-09-06 23:14:58.172943+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"0cfbf9326f34724005eb9102c2eac6dbb7e272c8e09e4d58395f72ef0f95d7fb","record_version_id":"fb21f0d0866223cfc48d3f9d73a9674c225599f158f0fa1f249c2bb47a381d19","job_id":"enrich-5291a20b802b9bbbe22b24cb","output_id":"be4665421c167bf43c1480d215a22828e5074c3ccd0f860f9d84c387f3edd039","section":"requirements","status":"invalid","value_json":null,"candidate_json":"{\"nodes\":[{\"children\":[\"n0\",\"n1\",\"n2\"],\"condition\":null,\"course\":null,\"evidence\":\"(M S & E 330and351), graduate/professional standing, or member of Engineering Guest Students\",\"id\":\"n0\",\"kind\":\"any\"},{\"children\":[\"n3\",\"n4\"],\"condition\":null,\"course\":null,\"evidence\":\"M S & E 330and351\",\"id\":\"n1\",\"kind\":\"all\"},{\"children\":[],\"condition\":null,\"course\":{\"course_number\":330,\"minimum_grade\":null,\"subjects\":[\"MS&E\"],\"timing\":\"prior\"},\"evidence\":\"M S & E 330\",\"id\":\"n3\",\"kind\":\"course\"},{\"children\":[],\"condition\":null,\"course\":{\"course_number\":351,\"minimum_grade\":null,\"subjects\":[\"MS&E\"],\"timing\":\"prior\"},\"evidence\":\"351\",\"id\":\"n4\",\"kind\":\"course\"},{\"children\":[],\"condition\":\"graduate/professional standing\",\"course\":null,\"evidence\":\"graduate/professional standing\",\"id\":\"n2\",\"kind\":\"condition\"},{\"children\":[],\"condition\":\"member of Engineering Guest Students\",\"course\":null,\"evidence\":\"member of Engineering Guest Students\",\"id\":\"n5\",\"kind\":\"condition\"}],\"notes\":[\"Node n1 combines MS&E 330 and 351 as an AND condition.\"],\"root\":\"n0\",\"status\":\"parsed\"}","error":"Node n0 references itself; remove the self-reference.\nCycle reaches node n0; requirement graphs must be trees.\nUnreachable nodes: n5; connect all conditions and exclusions to the root.","model":"nvidia/Qwen3.6-35B-A3B-NVFP4","model_revision":"1355db6a052410cfd62085d94b58866fd0f2c3c5","selected_for_release":false},{"run_id":"20260906T231458-5fdd2fff","observed_at":"2026-09-06 23:14:58.172943+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"0cfbf9326f34724005eb9102c2eac6dbb7e272c8e09e4d58395f72ef0f95d7fb","record_version_id":"fb21f0d0866223cfc48d3f9d73a9674c225599f158f0fa1f249c2bb47a381d19","job_id":"enrich-5291a20b802b9bbbe22b24cb","output_id":"be4665421c167bf43c1480d215a22828e5074c3ccd0f860f9d84c387f3edd039","section":"search_profile","status":"valid","value_json":"{\"assumed_background\":[{\"evidence\":[{\"course_id\":\"MS&E 330\",\"field\":\"description\",\"quote\":\"Introduction to thermodynamics of materials, equilibrium constants, solutions, heterogeneous equilibria and electrochemistry.\"}],\"text\":\"Thermodynamics of materials\"},{\"evidence\":[{\"course_id\":\"MS&E 351\",\"field\":\"description\",\"quote\":\"Introduction to: atomic, electronic, and defect structures in materials; diffusional, mechanical and electrical properties of materials; and the role of structure and defects in diffusional, mechanical, and electrical properties.\"}],\"text\":\"Materials science structure and property relations\"}],\"search_phrases\":[\"thin-film deposition\",\"sputter deposition\",\"chemical vapor deposition\",\"MS&E 434\",\"thin film properties\"],\"skills_taught\":[{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Introduction to major thin-film deposition techniques\"}],\"text\":\"Thin-film deposition techniques\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Film properties and characterization methods\"}],\"text\":\"Film characterization methods\"}],\"summary\":{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"title\",\"quote\":\"INTRODUCTION TO THIN-FILM DEPOSITION PROCESSES\"},{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Introduction to major thin-film deposition techniques and properties of thin films.\"}],\"text\":\"Introduction to thin-film deposition processes and characterization methods.\"},\"topics\":[{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Evaporation, plasma assisted processes with emphasis on sputter deposition, chemical vapor deposition ion beams.\"}],\"text\":\"Evaporation and plasma assisted processes\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"sputter deposition\"}],\"text\":\"Sputter deposition\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"chemical vapor deposition\"}],\"text\":\"Chemical vapor deposition\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"ion beams\"}],\"text\":\"Ion beams\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Film properties and characterization methods\"}],\"text\":\"Film properties and characterization\"}]}","candidate_json":null,"error":null,"model":"nvidia/Qwen3.6-35B-A3B-NVFP4","model_revision":"1355db6a052410cfd62085d94b58866fd0f2c3c5","selected_for_release":false},{"run_id":"20260906T231458-5fdd2fff","observed_at":"2026-09-06 23:14:58.172943+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"0cfbf9326f34724005eb9102c2eac6dbb7e272c8e09e4d58395f72ef0f95d7fb","record_version_id":"fb21f0d0866223cfc48d3f9d73a9674c225599f158f0fa1f249c2bb47a381d19","job_id":"enrich-5291a20b802b9bbbe22b24cb","output_id":"be4665421c167bf43c1480d215a22828e5074c3ccd0f860f9d84c387f3edd039","section":"student_experience","status":"insufficient_evidence","value_json":"{\"status\":\"insufficient_evidence\",\"themes\":[]}","candidate_json":null,"error":null,"model":"nvidia/Qwen3.6-35B-A3B-NVFP4","model_revision":"1355db6a052410cfd62085d94b58866fd0f2c3c5","selected_for_release":false},{"run_id":"20260907T155543-ce3781c4","observed_at":"2026-09-07 15:55:43.033547+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"0cfbf9326f34724005eb9102c2eac6dbb7e272c8e09e4d58395f72ef0f95d7fb","record_version_id":"fb21f0d0866223cfc48d3f9d73a9674c225599f158f0fa1f249c2bb47a381d19","job_id":"enrich-5590a4969e0a630fe46a86e8","output_id":"d6c5252a5ede0dc30561d884f72466d0c6f6823339c96441e893d209dd1b5811","section":"requirements","status":"valid","value_json":"{\"nodes\":[{\"children\":[\"n1\",\"n4\",\"n5\"],\"condition\":null,\"course\":null,\"evidence\":\"(M S & E 330and351), graduate/professional standing, or member of Engineering Guest Students\",\"id\":\"n0\",\"kind\":\"any\"},{\"children\":[\"n2\",\"n3\"],\"condition\":null,\"course\":null,\"evidence\":\"M S & E 330and351\",\"id\":\"n1\",\"kind\":\"all\"},{\"children\":[],\"condition\":null,\"course\":{\"course_number\":330,\"minimum_grade\":null,\"subjects\":[\"MS&E\"],\"timing\":\"prior\"},\"evidence\":\"M S & E 330\",\"id\":\"n2\",\"kind\":\"course\"},{\"children\":[],\"condition\":null,\"course\":{\"course_number\":351,\"minimum_grade\":null,\"subjects\":[\"MS&E\"],\"timing\":\"prior\"},\"evidence\":\"351\",\"id\":\"n3\",\"kind\":\"course\"},{\"children\":[],\"condition\":\"graduate/professional standing\",\"course\":null,\"evidence\":\"graduate/professional standing\",\"id\":\"n4\",\"kind\":\"condition\"},{\"children\":[],\"condition\":\"member of Engineering Guest Students\",\"course\":null,\"evidence\":\"member of Engineering Guest Students\",\"id\":\"n5\",\"kind\":\"condition\"}],\"notes\":[],\"root\":\"n0\",\"status\":\"parsed\"}","candidate_json":null,"error":null,"model":"nvidia/Qwen3.6-35B-A3B-NVFP4","model_revision":"1355db6a052410cfd62085d94b58866fd0f2c3c5","selected_for_release":false},{"run_id":"20260907T155543-ce3781c4","observed_at":"2026-09-07 15:55:43.033547+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"0cfbf9326f34724005eb9102c2eac6dbb7e272c8e09e4d58395f72ef0f95d7fb","record_version_id":"fb21f0d0866223cfc48d3f9d73a9674c225599f158f0fa1f249c2bb47a381d19","job_id":"enrich-5590a4969e0a630fe46a86e8","output_id":"d6c5252a5ede0dc30561d884f72466d0c6f6823339c96441e893d209dd1b5811","section":"search_profile","status":"valid","value_json":"{\"assumed_background\":[{\"evidence\":[{\"course_id\":\"MS&E 330\",\"field\":\"description\",\"quote\":\"Introduction to thermodynamics of materials, equilibrium constants, solutions, heterogeneous equilibria and electrochemistry.\"}],\"text\":\"Thermodynamics of materials\"},{\"evidence\":[{\"course_id\":\"MS&E 351\",\"field\":\"description\",\"quote\":\"Introduction to: atomic, electronic, and defect structures in materials; diffusional, mechanical and electrical properties of materials; and the role of structure and defects in diffusional, mechanical, and electrical properties.\"}],\"text\":\"Materials science structure and property relations\"}],\"search_phrases\":[\"thin-film deposition\",\"sputter deposition\",\"chemical vapor deposition\",\"MS&E 434\",\"thin film properties\"],\"skills_taught\":[{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Introduction to major thin-film deposition techniques\"}],\"text\":\"Thin-film deposition techniques\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Film properties and characterization methods\"}],\"text\":\"Film characterization methods\"}],\"summary\":{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"title\",\"quote\":\"INTRODUCTION TO THIN-FILM DEPOSITION PROCESSES\"},{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Introduction to major thin-film deposition techniques and properties of thin films.\"}],\"text\":\"Introduction to thin-film deposition processes and characterization methods.\"},\"topics\":[{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Evaporation, plasma assisted processes with emphasis on sputter deposition, chemical vapor deposition ion beams.\"}],\"text\":\"Evaporation and plasma assisted processes\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"sputter deposition\"}],\"text\":\"Sputter deposition\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"chemical vapor deposition\"}],\"text\":\"Chemical vapor deposition\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"ion beams\"}],\"text\":\"Ion beams\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Film properties and characterization methods\"}],\"text\":\"Film properties and characterization\"}]}","candidate_json":null,"error":null,"model":"nvidia/Qwen3.6-35B-A3B-NVFP4","model_revision":"1355db6a052410cfd62085d94b58866fd0f2c3c5","selected_for_release":false},{"run_id":"20260907T155543-ce3781c4","observed_at":"2026-09-07 15:55:43.033547+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"0cfbf9326f34724005eb9102c2eac6dbb7e272c8e09e4d58395f72ef0f95d7fb","record_version_id":"fb21f0d0866223cfc48d3f9d73a9674c225599f158f0fa1f249c2bb47a381d19","job_id":"enrich-5590a4969e0a630fe46a86e8","output_id":"d6c5252a5ede0dc30561d884f72466d0c6f6823339c96441e893d209dd1b5811","section":"student_experience","status":"insufficient_evidence","value_json":"{\"status\":\"insufficient_evidence\",\"themes\":[]}","candidate_json":null,"error":null,"model":"nvidia/Qwen3.6-35B-A3B-NVFP4","model_revision":"1355db6a052410cfd62085d94b58866fd0f2c3c5","selected_for_release":false},{"run_id":"20261014T203208-0851c9a1","observed_at":"2026-10-14 17:50:09.728220+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"d03f933070a53a81c2661877ad99da8e62e69c3703d0a2041c2eaa02c456dad2","record_version_id":"dcce185a0b1e8a5b564d959abfcc2a014b23620620314485bc10646e141c1b41","job_id":"enrich-6556a505c10f448d98d02466","output_id":"52cc5641d04bc3cacb0acd4cda1c56b82cd3ccec44f7f67dee623257924ca943","section":"requirements","status":"valid","value_json":"{\"nodes\":[{\"children\":[\"n1\",\"n2\",\"n3\"],\"condition\":null,\"course\":null,\"evidence\":\"(M S & E 330and351), graduate/professional standing, or member of Engineering Guest Students\",\"id\":\"root\",\"kind\":\"any\"},{\"children\":[\"c330\",\"c351\"],\"condition\":null,\"course\":null,\"evidence\":\"(M S & E 330and351)\",\"id\":\"n1\",\"kind\":\"all\"},{\"children\":[],\"condition\":\"graduate/professional standing\",\"course\":null,\"evidence\":\"graduate/professional standing\",\"id\":\"n2\",\"kind\":\"condition\"},{\"children\":[],\"condition\":\"member of Engineering Guest Students\",\"course\":null,\"evidence\":\"member of Engineering Guest Students\",\"id\":\"n3\",\"kind\":\"condition\"},{\"children\":[],\"condition\":null,\"course\":{\"course_number\":330,\"minimum_grade\":null,\"subjects\":[\"MS&E\"],\"timing\":\"prior\"},\"evidence\":\"M S & E 330\",\"id\":\"c330\",\"kind\":\"course\"},{\"children\":[],\"condition\":null,\"course\":{\"course_number\":351,\"minimum_grade\":null,\"subjects\":[\"MS&E\"],\"timing\":\"prior\"},\"evidence\":\"351\",\"id\":\"c351\",\"kind\":\"course\"}],\"notes\":[],\"root\":\"root\",\"status\":\"parsed\"}","candidate_json":null,"error":null,"model":"Qwen/Qwen3.8-27B","model_revision":"1d4bf0f2ff6012fd82039f2fa52739d0dd7c60c0","selected_for_release":false},{"run_id":"20261014T203208-0851c9a1","observed_at":"2026-10-14 17:50:09.728220+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"d03f933070a53a81c2661877ad99da8e62e69c3703d0a2041c2eaa02c456dad2","record_version_id":"dcce185a0b1e8a5b564d959abfcc2a014b23620620314485bc10646e141c1b41","job_id":"enrich-6556a505c10f448d98d02466","output_id":"52cc5641d04bc3cacb0acd4cda1c56b82cd3ccec44f7f67dee623257924ca943","section":"search_profile","status":"valid","value_json":"{\"activity_tags\":[{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Introduction to major thin-film deposition techniques and properties of thin films. Evaporation, plasma assisted processes with emphasis on sputter deposition, chemical vapor deposition ion beams. Film properties and characterization methods, applications.\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"label\":\"lab-work\"}],\"assumed_background\":[],\"search_phrases\":[\"thin-film deposition\",\"sputter deposition\",\"chemical vapor deposition\",\"plasma assisted processes\",\"film characterization\",\"evaporation\",\"ion beams\",\"MBE\",\"laser ablation\",\"vacuum science\"],\"skills_taught\":[{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"official_learning_outcomes\",\"outcome_index\":0,\"quote\":\"Apply concepts of the kinetic theory of gases to vacuum science and technology\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Apply kinetic theory of gases to vacuum science and technology\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"official_learning_outcomes\",\"outcome_index\":1,\"quote\":\"Explain the principles of evaporation, sputtering, molecular beam epitaxy (MBE), laser ablation, and chemical vapor deposition\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Explain principles of evaporation, sputtering, MBE, laser ablation, and CVD\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"official_learning_outcomes\",\"outcome_index\":2,\"quote\":\"Explain the concept of epitaxy in thin films\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Explain the concept of epitaxy in thin films\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"official_learning_outcomes\",\"outcome_index\":3,\"quote\":\"Explain the principles of various thin film characterization techniques\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Explain principles of thin film characterization techniques\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"official_learning_outcomes\",\"outcome_index\":4,\"quote\":\"Design thin film deposition systems\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Design thin film deposition systems\"}],\"summary\":{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"title\",\"quote\":\"INTRODUCTION TO THIN-FILM DEPOSITION PROCESSES\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"},{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Introduction to major thin-film deposition techniques and properties of thin films. Evaporation, plasma assisted processes with emphasis on sputter deposition, chemical vapor deposition ion beams. Film properties and characterization methods, applications.\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Introduction to major thin-film deposition techniques including evaporation, sputtering, CVD, and ion beams, plus film properties and characterization methods.\"},\"topics\":[{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Evaporation, plasma assisted processes with emphasis on sputter deposition, chemical vapor deposition ion beams.\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Thin-film deposition techniques: evaporation, sputtering, CVD, ion beams\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Film properties and characterization methods, applications.\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Film properties, characterization methods, and applications\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"official_learning_outcomes\",\"outcome_index\":0,\"quote\":\"Apply concepts of the kinetic theory of gases to vacuum science and technology\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Kinetic theory of gases applied to vacuum science and technology\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"official_learning_outcomes\",\"outcome_index\":2,\"quote\":\"Explain the concept of epitaxy in thin films\",\"source_url\":\"https://guide.wisc.edu/courses/m_s_e/\"}],\"text\":\"Epitaxy in thin films\"}]}","candidate_json":null,"error":null,"model":"Qwen/Qwen3.8-27B","model_revision":"1d4bf0f2ff6012fd82039f2fa52739d0dd7c60c0","selected_for_release":false},{"run_id":"20261014T203208-0851c9a1","observed_at":"2026-10-14 17:50:09.728220+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"d03f933070a53a81c2661877ad99da8e62e69c3703d0a2041c2eaa02c456dad2","record_version_id":"dcce185a0b1e8a5b564d959abfcc2a014b23620620314485bc10646e141c1b41","job_id":"enrich-6556a505c10f448d98d02466","output_id":"52cc5641d04bc3cacb0acd4cda1c56b82cd3ccec44f7f67dee623257924ca943","section":"student_experience","status":"insufficient_evidence","value_json":"{\"status\":\"insufficient_evidence\",\"themes\":[]}","candidate_json":null,"error":null,"model":"Qwen/Qwen3.8-27B","model_revision":"1d4bf0f2ff6012fd82039f2fa52739d0dd7c60c0","selected_for_release":false},{"run_id":"20260906T231458-5fdd2fff","observed_at":"2026-09-06 23:14:58.172943+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"0cfbf9326f34724005eb9102c2eac6dbb7e272c8e09e4d58395f72ef0f95d7fb","record_version_id":"fb21f0d0866223cfc48d3f9d73a9674c225599f158f0fa1f249c2bb47a381d19","job_id":"enrich-789789da373eecc1ff75f626","output_id":"26b55d0631bc422491950aba217ffd243070124862be26a0720a9cb4115259f0","section":"requirements","status":"valid","value_json":"{\"nodes\":[{\"children\":[\"n1\",\"n4\",\"n5\"],\"condition\":null,\"course\":null,\"evidence\":\"(M S & E 330and351), graduate/professional standing, or member of Engineering Guest Students\",\"id\":\"n0\",\"kind\":\"any\"},{\"children\":[\"n2\",\"n3\"],\"condition\":null,\"course\":null,\"evidence\":\"M S & E 330and351\",\"id\":\"n1\",\"kind\":\"all\"},{\"children\":[],\"condition\":null,\"course\":{\"course_number\":330,\"minimum_grade\":null,\"subjects\":[\"MS&E\"],\"timing\":\"prior\"},\"evidence\":\"M S & E 330\",\"id\":\"n2\",\"kind\":\"course\"},{\"children\":[],\"condition\":null,\"course\":{\"course_number\":351,\"minimum_grade\":null,\"subjects\":[\"MS&E\"],\"timing\":\"prior\"},\"evidence\":\"351\",\"id\":\"n3\",\"kind\":\"course\"},{\"children\":[],\"condition\":\"graduate/professional standing\",\"course\":null,\"evidence\":\"graduate/professional standing\",\"id\":\"n4\",\"kind\":\"condition\"},{\"children\":[],\"condition\":\"member of Engineering Guest Students\",\"course\":null,\"evidence\":\"member of Engineering Guest Students\",\"id\":\"n5\",\"kind\":\"condition\"}],\"notes\":[],\"root\":\"n0\",\"status\":\"parsed\"}","candidate_json":null,"error":null,"model":"nvidia/Qwen3.6-35B-A3B-NVFP4","model_revision":"1355db6a052410cfd62085d94b58866fd0f2c3c5","selected_for_release":false},{"run_id":"20260906T231458-5fdd2fff","observed_at":"2026-09-06 23:14:58.172943+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"0cfbf9326f34724005eb9102c2eac6dbb7e272c8e09e4d58395f72ef0f95d7fb","record_version_id":"fb21f0d0866223cfc48d3f9d73a9674c225599f158f0fa1f249c2bb47a381d19","job_id":"enrich-789789da373eecc1ff75f626","output_id":"26b55d0631bc422491950aba217ffd243070124862be26a0720a9cb4115259f0","section":"search_profile","status":"valid","value_json":"{\"assumed_background\":[{\"evidence\":[{\"course_id\":\"MS&E 330\",\"field\":\"description\",\"quote\":\"Introduction to thermodynamics of materials, equilibrium constants, solutions, heterogeneous equilibria and electrochemistry.\"}],\"text\":\"Thermodynamics of materials\"},{\"evidence\":[{\"course_id\":\"MS&E 351\",\"field\":\"description\",\"quote\":\"Introduction to: atomic, electronic, and defect structures in materials; diffusional, mechanical and electrical properties of materials; and the role of structure and defects in diffusional, mechanical, and electrical properties.\"}],\"text\":\"Materials science structure and property relations\"}],\"search_phrases\":[\"thin-film deposition\",\"sputter deposition\",\"chemical vapor deposition\",\"MS&E 434\",\"thin film properties\"],\"skills_taught\":[{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Introduction to major thin-film deposition techniques\"}],\"text\":\"Thin-film deposition techniques\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Film properties and characterization methods\"}],\"text\":\"Film characterization methods\"}],\"summary\":{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"title\",\"quote\":\"INTRODUCTION TO THIN-FILM DEPOSITION PROCESSES\"},{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Introduction to major thin-film deposition techniques and properties of thin films.\"}],\"text\":\"Introduction to thin-film deposition processes and characterization methods.\"},\"topics\":[{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Evaporation, plasma assisted processes with emphasis on sputter deposition, chemical vapor deposition ion beams.\"}],\"text\":\"Evaporation and plasma assisted processes\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"sputter deposition\"}],\"text\":\"Sputter deposition\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"chemical vapor deposition\"}],\"text\":\"Chemical vapor deposition\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"ion beams\"}],\"text\":\"Ion beams\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Film properties and characterization methods\"}],\"text\":\"Film properties and characterization\"}]}","candidate_json":null,"error":null,"model":"nvidia/Qwen3.6-35B-A3B-NVFP4","model_revision":"1355db6a052410cfd62085d94b58866fd0f2c3c5","selected_for_release":false},{"run_id":"20260906T231458-5fdd2fff","observed_at":"2026-09-06 23:14:58.172943+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"0cfbf9326f34724005eb9102c2eac6dbb7e272c8e09e4d58395f72ef0f95d7fb","record_version_id":"fb21f0d0866223cfc48d3f9d73a9674c225599f158f0fa1f249c2bb47a381d19","job_id":"enrich-789789da373eecc1ff75f626","output_id":"26b55d0631bc422491950aba217ffd243070124862be26a0720a9cb4115259f0","section":"student_experience","status":"insufficient_evidence","value_json":"{\"status\":\"insufficient_evidence\",\"themes\":[]}","candidate_json":null,"error":null,"model":"nvidia/Qwen3.6-35B-A3B-NVFP4","model_revision":"1355db6a052410cfd62085d94b58866fd0f2c3c5","selected_for_release":false},{"run_id":"20260907T155543-ce3781c4","observed_at":"2026-09-07 15:55:43.033547+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"0cfbf9326f34724005eb9102c2eac6dbb7e272c8e09e4d58395f72ef0f95d7fb","record_version_id":"fb21f0d0866223cfc48d3f9d73a9674c225599f158f0fa1f249c2bb47a381d19","job_id":"enrich-8b774950c2b6adfdc46d1b82","output_id":"0a49df9ce279afe751e6df82b099b0f60eb580cef257e113170fd393409b394d","section":"requirements","status":"valid","value_json":"{\"nodes\":[{\"children\":[\"n1\",\"n4\",\"n5\"],\"condition\":null,\"course\":null,\"evidence\":\"(M S & E 330and351), graduate/professional standing, or member of Engineering Guest Students\",\"id\":\"n0\",\"kind\":\"any\"},{\"children\":[\"n2\",\"n3\"],\"condition\":null,\"course\":null,\"evidence\":\"M S & E 330and351\",\"id\":\"n1\",\"kind\":\"all\"},{\"children\":[],\"condition\":null,\"course\":{\"course_number\":330,\"minimum_grade\":null,\"subjects\":[\"MS&E\"],\"timing\":\"prior\"},\"evidence\":\"M S & E 330\",\"id\":\"n2\",\"kind\":\"course\"},{\"children\":[],\"condition\":null,\"course\":{\"course_number\":351,\"minimum_grade\":null,\"subjects\":[\"MS&E\"],\"timing\":\"prior\"},\"evidence\":\"351\",\"id\":\"n3\",\"kind\":\"course\"},{\"children\":[],\"condition\":\"graduate/professional standing\",\"course\":null,\"evidence\":\"graduate/professional standing\",\"id\":\"n4\",\"kind\":\"condition\"},{\"children\":[],\"condition\":\"member of Engineering Guest Students\",\"course\":null,\"evidence\":\"member of Engineering Guest Students\",\"id\":\"n5\",\"kind\":\"condition\"}],\"notes\":[],\"root\":\"n0\",\"status\":\"parsed\"}","candidate_json":null,"error":null,"model":"nvidia/Qwen3.6-35B-A3B-NVFP4","model_revision":"1355db6a052410cfd62085d94b58866fd0f2c3c5","selected_for_release":false},{"run_id":"20260907T155543-ce3781c4","observed_at":"2026-09-07 15:55:43.033547+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"0cfbf9326f34724005eb9102c2eac6dbb7e272c8e09e4d58395f72ef0f95d7fb","record_version_id":"fb21f0d0866223cfc48d3f9d73a9674c225599f158f0fa1f249c2bb47a381d19","job_id":"enrich-8b774950c2b6adfdc46d1b82","output_id":"0a49df9ce279afe751e6df82b099b0f60eb580cef257e113170fd393409b394d","section":"search_profile","status":"valid","value_json":"{\"assumed_background\":[{\"evidence\":[{\"course_id\":\"MS&E 330\",\"field\":\"description\",\"quote\":\"Introduction to thermodynamics of materials, equilibrium constants, solutions, heterogeneous equilibria and electrochemistry.\"}],\"text\":\"Thermodynamics of materials\"},{\"evidence\":[{\"course_id\":\"MS&E 351\",\"field\":\"description\",\"quote\":\"Introduction to: atomic, electronic, and defect structures in materials; diffusional, mechanical and electrical properties of materials; and the role of structure and defects in diffusional, mechanical, and electrical properties.\"}],\"text\":\"Materials science structure and property relations\"}],\"search_phrases\":[\"thin-film deposition\",\"sputter deposition\",\"chemical vapor deposition\",\"MS&E 434\",\"thin film properties\"],\"skills_taught\":[{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Introduction to major thin-film deposition techniques\"}],\"text\":\"Thin-film deposition techniques\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Film properties and characterization methods\"}],\"text\":\"Film characterization methods\"}],\"summary\":{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"title\",\"quote\":\"INTRODUCTION TO THIN-FILM DEPOSITION PROCESSES\"},{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Introduction to major thin-film deposition techniques and properties of thin films.\"}],\"text\":\"Introduction to thin-film deposition processes and characterization methods.\"},\"topics\":[{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Evaporation, plasma assisted processes with emphasis on sputter deposition, chemical vapor deposition ion beams.\"}],\"text\":\"Evaporation and plasma assisted processes\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"sputter deposition\"}],\"text\":\"Sputter deposition\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"chemical vapor deposition\"}],\"text\":\"Chemical vapor deposition\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"ion beams\"}],\"text\":\"Ion beams\"},{\"evidence\":[{\"course_id\":\"MS&E 434\",\"field\":\"description\",\"quote\":\"Film properties and characterization methods\"}],\"text\":\"Film properties and characterization\"}]}","candidate_json":null,"error":null,"model":"nvidia/Qwen3.6-35B-A3B-NVFP4","model_revision":"1355db6a052410cfd62085d94b58866fd0f2c3c5","selected_for_release":false},{"run_id":"20260907T155543-ce3781c4","observed_at":"2026-09-07 15:55:43.033547+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"0cfbf9326f34724005eb9102c2eac6dbb7e272c8e09e4d58395f72ef0f95d7fb","record_version_id":"fb21f0d0866223cfc48d3f9d73a9674c225599f158f0fa1f249c2bb47a381d19","job_id":"enrich-8b774950c2b6adfdc46d1b82","output_id":"0a49df9ce279afe751e6df82b099b0f60eb580cef257e113170fd393409b394d","section":"student_experience","status":"insufficient_evidence","value_json":"{\"status\":\"insufficient_evidence\",\"themes\":[]}","candidate_json":null,"error":null,"model":"nvidia/Qwen3.6-35B-A3B-NVFP4","model_revision":"1355db6a052410cfd62085d94b58866fd0f2c3c5","selected_for_release":false},{"run_id":"20260907T155543-ce3781c4","observed_at":"2026-09-07 15:55:43.033547+00:00","course_uid":"course_abc26d5ccfb4076395bae83c","course_id":"MS&E 434","catalog_version_id":"0cfbf9326f34724005eb9102c2eac6dbb7e272c8e09e4d58395f72ef0f95d7fb","record_version_id":"fb21f0d0866223cfc48d3f9d73a9674c225599f158f0fa1f249c2bb47a381d19","job_id":"enrich-8b774950c2b6adfdc46d1b82","output_id":"0a49df9ce279afe751e6df82b099b0f60eb580cef257e113170fd393409b394d","section":"student_summary","status":"valid","value_json":"{\"context_hash\":\"429666321a915dcb0785551bc20071fe78ffb3b8d29007ed8ac7d0b0a404affb\",\"course_id\":\"MS&E 434\",\"current_instructors\":[],\"difficulty_workload\":[],\"errors\":[],\"historical_context\":[],\"message\":\"No course-specific reviews available\",\"offered\":false,\"profile_hash\":\"5cb4dabf887cdbcd8c00d5a1312e10828b95c63f30bc3ea76aea199565390d02\",\"quick_take\":[{\"citations\":[{\"course_id\":\"MS&E 434\",\"run_id\":\"20260907T155543-ce3781c4\",\"source_record\":{\"entity_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"file\":\"tables/observations.parquet\",\"kind\":\"grades\",\"source\":\"madgrades\"},\"table\":\"grades_latest\",\"term_id\":\"1244\",\"type\":\"grade\"},{\"course_id\":\"MS&E 434\",\"run_id\":\"20260907T155543-ce3781c4\",\"source_record\":{\"entity_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"file\":\"tables/observations.parquet\",\"kind\":\"grades\",\"source\":\"madgrades\"},\"table\":\"grades_latest\",\"term_id\":\"1254\",\"type\":\"grade\"},{\"course_id\":\"MS&E 434\",\"run_id\":\"20260907T155543-ce3781c4\",\"source_record\":{\"entity_id\":\"c5b7aec0-20c1-3a87-a2a1-0a195ee76a9d\",\"file\":\"tables/observations.parquet\",\"kind\":\"grades\",\"source\":\"madgrades\"},\"table\":\"grades_latest\",\"term_id\":\"1264\",\"type\":\"grade\"}],\"text\":\"Recent recorded grades — Spring 2024: 3.94 GPA, 100.0% A/AB (n=16 letter grades); Spring 2025: 3.93 GPA, 100.0% A/AB (n=7 letter grades); Spring 2026: 3.86 GPA, 92.9% A/AB (n=14 letter grades).\"}],\"student_experience\":[],\"task_hash\":\"74fb0997943e888960bbc9e47db8c4fd12e4292d55c20509d8d89db6a9910f68\",\"teaching_history\":[],\"term_id\":\"1272\",\"term_name\":\"2026 Fall\",\"version\":2}","candidate_json":null,"error":null,"model":"nvidia/Qwen3.6-35B-A3B-NVFP4","model_revision":"1355db6a052410cfd62085d94b58866fd0f2c3c5","selected_for_release":false}]