Spring 2027

Printed and Flexible Electronics: Manufacturing, Devices, and Applications

Printed and flexible electronics covering additive fabrication of thin-film electronics, printable techniques, materials, and applications, with a key focus on mechanically flexible electronic devices.

offering recorded3 credits
Recorded instructors · Spring 2027 Joseph Andrews3.4/5

Summary

1 / 2

Recent recorded grades — Spring 2025: 3.81 GPA, 95.8% A/AB (n=24 letter grades).

What you’ll be able to do

  • Define the broad field of printed/thin-film electronics

  • Describe the multiple techniques for printing electronics

  • Identify the appropriate technique for specific target applications

  • Describe applications of materials for insulating, conducting, and semiconducting, required for advanced thin-film electronics

  • Benchmark printed devices including sensors and thin-film transistors

  • Design printable electronic sensors to desired specifications

  • Describe the current challenges of the field of printable electronics

Source: UW Guide 1 UW Guide 2

Grade history

↗
average GPA
letter grades
A
AB
B
BC
C
D
F

All recorded terms · compare terms & instructors

Prerequisites

Course map

E C E 230 or 376, graduate/professional standing, or member of Engineering Guest Students

    • ECE 230
    • ECE 376
    • graduate/professional standing
    • member of Engineering Guest Students
    take one
ECE/ME 576

This is a best-effort interpretation; check the catalog requirements above.

Prerequisite text tree
  • Any of
    • ECE 230
    • ECE 376
    • graduate/professional standing
    • member of Engineering Guest Students

Professors

Spring 2027
Adjusted rating
RMP difficulty
captured reviews
About this rating

Raw average: 1.00/5 from 2 quality ratings. The adjusted rating blends this with the UW review average (3.66/5), weighted as 20 additional ratings. Smaller samples stay closer to that average. Each captured review is counted once in the prior; this does not correct who chooses to leave a review.

RMP profile ↗ · All captured review dates; profile matched by name.

Recent recorded grades — Spring 2025: 3.81 GPA, 95.8% A/AB (n=24 letter grades). Includes jointly taught sections.

Historical instructors & teaching patterns

JOSEPH ANDREWS is recorded teaching in Spring 2025. Recorded history may be incomplete and does not establish a future schedule.

Recorded history may be incomplete and does not establish a future schedule.

Calendar & sections

Spring 2027

Schedule loads here as you scroll.

SectionModeEnrolled / capacityWaitlist
LEC 001Classroom Instruction0 / 300
LEC 001Classroom Instruction0 / 300

Times are Central. Select a meeting for details; export includes recorded dates for the selected sections. Enrollment reflects scan time.

Meeting source records
Download part 1

Student experience

the class

Recent recorded grades — Spring 2025: 3.81 GPA, 95.8% A/AB (n=24 letter grades).

difficulty & workload

No workload feedback recorded.

Topics

  • Additive fabrication of thin-film electronics
  • Techniques, materials, and applications of printable electronics
  • Mechanically flexible electronic devices
  • Insulating, conducting, and semiconducting materials for advanced thin-film electronics

Skills

  • Selecting printing technologies and materials for target device performance
  • Benchmarking printed devices such as sensors and thin-film transistors
  • Designing printable electronic sensors to specification

Grades

Latest available · Spring 2025— not enough history to project Spring 2027.

average GPA
A / AB grades
letter grades
Instructor

Grade distribution · % of letter grades

A
AB
B
BC
C
D
F
More grade details Grade mix, volume & source data

Not enough comparable courses for Spring 2027 in UW–Madison.

Sources & history

UW–Madison

Catalog & offerings

Descriptions, prerequisites, and recorded course offerings.

Catalog observation history

Observations at scan time; dates do not imply when a catalog change took effect.

Download part 1
Selected offering source records
ECE/ME 576 · Spring 2027

Printed and Flexible Electronics: Manufacturing, Devices, and Applications

Recorded 2026-10-14
ECE/ME 576 · Spring 2027

Printed and Flexible Electronics: Manufacturing, Devices, and Applications

Recorded 2026-10-14
Raw records 
[
  {
    "run_id": "20261014T203208-0851c9a1",
    "semester": "1274",
    "observed_at": "2026-10-14 17:50:09.728220+00:00",
    "offering_id": "1274:320:026898",
    "course_id": "ECE/ME 576",
    "course_uid": "course_3163b1e692f4379758b154f9",
    "term_id": "1274",
    "source_course_id": "026898",
    "source_subject_id": "320",
    "title": "Printed and Flexible Electronics: Manufacturing, Devices, and Applications",
    "credits_min": 3,
    "credits_max": 3,
    "typically_offered": "Not Applicable"
  },
  {
    "run_id": "20261014T203208-0851c9a1",
    "semester": "1274",
    "observed_at": "2026-10-14 17:50:09.728220+00:00",
    "offering_id": "1274:612:026898",
    "course_id": "ECE/ME 576",
    "course_uid": "course_3163b1e692f4379758b154f9",
    "term_id": "1274",
    "source_course_id": "026898",
    "source_subject_id": "612",
    "title": "Printed and Flexible Electronics: Manufacturing, Devices, and Applications",
    "credits_min": 3,
    "credits_max": 3,
    "typically_offered": "Not Applicable"
  }
]
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Student reviews

Original comments behind the course and instructor summaries.

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Madgrades

Grade history

Recorded grade distributions by term, section, and instructor.

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Dataset & model

Recorded 2026-10-14

View the dataset on Hugging Face
Model outputs & technical records
Qwen/Qwen3.8-27B
LLM outputs across runs
Download part 1
Full model traces

Recorded model configuration, reasoning, and tool conversations.

Download part 1
Model & dataset provenance 
{
  "model": "Qwen/Qwen3.8-27B",
  "model_revision": "1d4bf0f2ff6012fd82039f2fa52739d0dd7c60c0",
  "task_version": "17",
  "output_id": "9b0d1506e6f18e5933e84d35d29e8eadeb758de12be3051a2965af68828be5a9",
  "requirements_status": "valid",
  "dataset_revision": "fc1811fa52e581ea57a35c0cf3343f8740a8ffbf",
  "observed_at": "2026-10-14 17:50:09.728220+00:00"
}